Leakage current reduction in electronic devices

ABSTRACT

Methods, systems, and devices for leakage current reduction in electronic devices are described. Electronic devices may be susceptible to leakage currents when operating in a first mode, such as an inactive (e.g., a standby) mode. To mitigate leakage current, an electronic device may include transistors coupled in cascode configuration where a gate of a drain-side transistor in the cascode configuration is configured to be biased by an adjustable (e.g., a dynamic) control signal. When the transistors are inactive (e.g., “off”), the control signal may be adjusted to prevent leakage associated with the inactive transistors. Further, a source-side transistor in the cascode configuration may be configured to have a high threshold voltage (e.g., relative to the drain-side transistor).

BACKGROUND

The following relates generally to leakage current reduction and morespecifically to leakage current reduction for transistors.

In an electrical device (e.g., an integrated circuit), leakage currentmay result in undesired power consumption when the device is in astandby state, which may also be referred to as an inactive, idle, oroff state. For example, a transistor may conduct a non-zero amount ofleakage current even when the transistor is configured to be in an off(e.g., cutoff) state. A number of such transistors in an electricaldevice may each contribute to an overall amount of leakage current andthus to an overall amount of power consumption by the electrical devicewhen the electrical device is in a standby state.

Memory devices are one example of a type of device that may utilize oneor more transistors. Memory devices are widely used to store informationin various electronic devices such as computers, cameras, digitaldisplays, and the like. Information is stored by programing differentstates of a memory device. For example, binary devices have two states,often denoted by a logic “1” or a logic “0.” In other systems, more thantwo states may be stored. To access the stored information, a componentof the electronic device may read, or sense, the stored state in thememory device. To store information, a component of the electronicdevice may write, or program, the state in the memory device. A memorydevice may use an inverter to receive a signal having a first logicstate (e.g., a logic “0”) and output a signal having a second logicstate (e.g., a logic “1”).

Improved solutions for reducing leakage current associated withtransistors—whether included within a memory device or another type ofelectronic devices and/or systems—are desired.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example of a memory array that supports leakagecurrent reduction in electronic devices in accordance with examples ofthe present disclosure.

FIGS. 2 and 3 illustrate example circuits that support leakage currentreduction in electronic devices in accordance with examples of thepresent disclosure.

FIG. 4 illustrates an example of table depicting example transistortypes implemented in a circuit that supports leakage current reductionin electronic devices in accordance with aspects of the presentdisclosure.

FIG. 5 illustrates an example timing diagram of operating a circuit thatsupports leakage current reduction in electronic devices in accordancewith aspects of the present disclosure.

FIG. 6 illustrates a block diagram of a device that supports leakagecurrent reduction in electronic devices in accordance with aspects ofthe present disclosure.

FIGS. 7 through 9 show flowcharts illustrating methods that supportleakage current reduction in electronic devices in accordance withaspects of the present disclosure.

DETAILED DESCRIPTION

A transistor may be conceptualized in some cases as a perfect switch,meaning as an open circuit with infinite resistance when in an “off”state (e.g., when biased in cutoff mode) and as a short circuit withzero resistance when in an “on” state (e.g., when biased in saturationmode). A transistor as actually implemented in an electronic device(e.g., in an integrated circuit), however, may not be ideal and thus mayallow some current to flow even when nominally in the off state andexhibit a non-zero resistance when in the on state. Current that flowsthrough a transistor when the transistor is in the off state may bereferred to as leakage current and may result in a corresponding amountof undesired power consumption, among other adverse conditions.

Some transistors (e.g., metal-oxide-semiconductor field effecttransistors (MOSFETs) may exhibit a type of leakage current referred toas gate-induced drain leakage (GIDL). The gate and drain of a transistormay overlap spatially within the transistor, and amplification of chargein the overlapped region may give rise to GIDL. Accordingly, themagnitude or amount of GIDL may be proportional to the difference involtage between the drain and gate of the transistor. For example, in anNMOS transistor, GIDL may occur when the drain of the transistor is at ahigher voltage than the gate of the transistor, and GIDL may increasewhen the difference between the voltage at the drain and the voltage atthe gate increases. Conversely, in a PMOS transistor, GIDL may occurwhen the gate of the transistor is at a higher voltage than the drain ofthe transistor, and GIDL may increase when the difference between thevoltage at the gate and the voltage at the drain increases.

Additionally or alternatively, some transistors (e.g.,metal-oxide-semiconductor field effect transistors (MOSFETs) may exhibita type of leakage current referred to as subthreshold leakage (ISUB).ISUB may generally refer to leakage current that occurs when thedifference between the voltage of the gate of a transistor and thevoltage of the source of the transistor (gate-source voltage) is belowthe threshold voltage (Vth) of the transistor. As the magnitudes ofsupply voltages in electronic devices are reduced, the thresholdvoltages of transistors may be correspondingly reduced. And as thethreshold voltage of a transistor is reduced, the difference between agate-source voltage associated with the transistor being on versus thegate-source voltage associated with the transistor being off may becorrespondingly reduced, such that a reduced threshold voltage maycorrespond to a reduced (weakened) ability to fully “turn off” thetransistor. An amount or magnitude of ISUB may be inversely proportionto Vth, and a transistor with a high Vth may exhibit reduced ISUBrelative to a transistor with a low Vth. Further, ISUB may flow from thedrain to the source of a transistor and therefore may also beproportional to the difference in voltage between the drain and sourceof the transistor, such that reducing the difference in voltage betweenthe drain and source of the transistor may reduce ISUB.

GIDL, ISUB, and other forms of leakage current may be undesirable asthey may result in increased power consumption and otherwise diminishoverall performance of an electronic device. Techniques described hereinmay beneficially reduce leakage current—such as GIDL and ISUB—in anelectronic device, including for transistors configured to be an offstate when the device is in a standby mode.

For example, in some cases, a single transistor in an electronic devicemay be replaced by two transistors in a cascode arrangement. Further, insome cases, at least one transistor having a relatively high Vth (e.g.,as compared to one or more other transistors in an electronic device)may be utilized in the cascode arrangement.

For example, in a cascode of two transistors, a first transistor mayhave its source coupled with the drain of a second transistor, and thesource of the second transistor may function as a source for the cascodearrangement while the drain of the first transistor may function as adrain for the cascode arrangement. Thus, the first transistor may bereferred to as the drain-side transistor of the cascode arrangementwhile the second transistor may be referred to as the source-sidetransistor of the cascode arrangement. In some cases, the source-sidetransistor may have a relatively high Vth (e.g., as compared to one ormore other transistors in the electronic device, including possibly ascompared to the drain-side transistor), which may beneficially reduceleakage current (e.g., ISUB) through the cascode arrangement. Someexamples may forgo a cascode arrangement for a transistor configured tobe on during a standby mode, and a cascode arrangement in which at leastthe source-side transistor has a relatively high Vth may be utilizedwhere the source-side transistor is configured to be off during thestandby mode.

Additionally or alternatively, the drain-side transistor in a cascodearrangement may have a gate configured to be biased by a dynamic (e.g.,variable, adjustable, switchable) control signal (which may also bereferred to as a dynamic bias voltage). Thus, the gate of the drain sidetransistor may be biased at a first voltage when the electronic deviceis an active or on mode and may be biased at a second voltage when theelectronic device is in the standby mode.

During the active mode, the voltage of the dynamic control signal may beconfigured to be equal to an upper supply voltage (e.g., a positivevoltage) or a lower supply voltage (e.g., a negative voltage or a groundreference). Thus, during the active mode, in some cases the voltage ofthe dynamic control signal may be at a rail voltage. During the standbymode, the voltage of the dynamic control signal may be changed to bebetween the upper supply voltage and the lower supply voltage, whichmay—relative to voltage of the dynamic control signal during the activemode—reduce the drain voltage of an NMOS source-side transistor orincrease the drain voltage of a PMOS source-side transistor and therebyreduce leakage current through the source-side transistor (e.g., GIDLand ISUB). Thus, a voltage swing of the dynamic control signal may beless than a difference between the upper supply voltage and lower supplyvoltage (e.g., may be less than a rail-to-rail voltage for theelectronic device or for the cascode arrangement).

Features of the disclosure are initially described in the context of amemory system. Features of the disclosure are described in the contextof example circuits, a timing diagram, and a device diagram inaccordance with aspects of the present disclosure. These and otherfeatures of the disclosure are further illustrated by and described withreference to apparatus diagrams, system diagrams, and flowcharts thatrelate to leakage current reduction in electronic devices. In somecases, aspects of the techniques described herein are illustrated anddescribed in the context of one or more inverters, but it is to beunderstood that the techniques described herein may be utilized in andapplied to any electronic circuit in which reduced leakage currentthrough one or more transistors is desired, including, but not limitedto, logic gates other than inverters. Similarly, in some cases, aspectsof the techniques described herein are illustrated and described in thecontext of a memory device, but it is to be understood that thetechniques described herein may be utilized in and applied to anyelectronic device in which reduced leakage current through one or moretransistors is desired.

FIG. 1 illustrates an example of a system 100 that utilizes one or morememory devices in accordance with various examples of the presentdisclosure. The system 100 may include a controller 105, a memory device110, and a plurality of channels 115 coupling the controller 105 withthe memory device 110. The system 100 may include one or more memorydevices, but for ease of description the one or more memory devices maybe described as a single memory device.

The system 100 may be an example of an electronic device, such as acomputing device, a mobile computing device, a wireless device, aportable electronic device, a graphics processing device, a computer, alaptop computer, a tablet computer, a smartphone, a cellular phone, awearable device, an internet-connected device, or the like. The memorydevice 110 may be component of the system configured to store data forone or more other components of the system 100.

At least portions of the system 100 may be an example of a host device120. The host device 120 may be an example of a component or device thatis coupled with the memory device 110 and that uses memory to executeprocesses related to the operation of the host device 120. In somecases, the host device 120 may refer to the hardware, firmware,software, or a combination thereof that implements the functions of thecontroller 105.

In some cases, a memory device 110 may be an independent device orcomponent that is configured to communicate with other components of thesystem 100 and provide physical memory addresses/space to be used orreferenced by the system 100. In some examples, a memory device 110 maybe configured to interface with at least one or a plurality of differenttypes of systems. Signaling between the components of the system 100 andthe memory device 110 may support modulation schemes to modulate thesignals, pin designs for communicating the signals, distinct packagingof the system 100 and the memory device 110, clocking andsynchronization between the system 100 and the memory device 110, timingconventions, and/or other factors.

The memory device 110 may be configured to store data for the componentsof the system 100. In some cases, the memory device 110 may act as aslave-type device to the controller 105 (e.g., responding to andexecuting commands provided by other components of the system 100through the controller 105). Such commands may include an access commandfor an access operation, such as a write command for a write operation,a read command for a read operation, a refresh command for a refreshoperation, or other commands.

The system 100 may further include a processor 125, a basic input/outputsystem (BIOS) component 130, one or more peripheral components 135, andan input/output (I/O) controller 140. The components of system 100 maybe in electronic communication with one another using a bus 145.

The processor 125 may be configured to control at least portions of thesystem 100. The processor 125 may be a general-purpose processor, adigital signal processor (DSP), an application-specific integratedcircuit (ASIC), a field-programmable gate array (FPGA) or otherprogrammable logic device, discrete gate or transistor logic, discretehardware components, or it may be a combination of these types ofcomponents. In such cases, the processor 125 may be an example of acentral processing unit (CPU), a graphics processing unit (GPU), or asystem on a chip (SoC), among other examples.

The BIOS component 130 may be a firmware or software component that mayinitialize and run various hardware components of the system 100. TheBIOS component 130 may manage data flow between the processor 125 andthe various components of the system 100, e.g., the peripheralcomponents 135, the I/O controller 140, etc. The BIOS component 130 mayinclude a program or software stored in ROM, flash memory, or any othernon-volatile memory.

The peripheral component(s) 130 may be any input device or outputdevice, or an interface for such devices, that may be integrated into orwith the system 100. Examples may include disk controllers, soundcontroller, graphics controller, Ethernet controller, modem, universalserial bus (USB) controller, a serial or parallel port, or peripheralcard slots, such as peripheral component interconnect (PCI) oraccelerated graphics port (AGP) slots. The peripheral component(s) 130may be other components understood by those skilled in the art asperipherals.

The I/O controller 140 may manage data communication between theprocessor 125 and the peripheral component(s) 135, input devices 150, oroutput devices 155. The I/O controller 140 may manage peripherals thatare not integrated into or with the system 100. In some cases, the I/Ocontroller 140 may represent a physical connection or port to externalperipheral components.

The input 150 may represent a device or signal external to the system100 that provides information, signals, or data to the system 100 or itscomponents. This may include a user interface or interface with orbetween other devices. In some cases, the input 150 may be a peripheralthat interfaces with system 100 via one or more of the peripheralcomponents 135 or may be managed by the I/O controller 140.

The output device 155 may represent a device or signal external to thesystem 100 configured to receive an output from the system 100 or any ofits components. Examples of the output device 155 may include a display,audio speakers, a printing device, or another processor on printedcircuit board, etc. In some cases, the output device 155 may be aperipheral that interfaces with the system 100 via one or more of theperipheral components 135 or may be managed by the I/O controller 140.

The components of system 100 may be made up of general-purpose orspecial-purpose circuitry designed to carry out their functions. Thismay include various circuit elements, for example, conductive lines,transistors, capacitors, inductors, resistors, amplifiers, or otheractive or passive elements, configured to carry out the functionsdescribed herein. In some cases, one or more transistors in system 100may be configured to have a high Vth relative to one or more othertransistors in system 100. In some cases, one or more transistors insystem 100 may be configured in a cascode arrangement, and thesource-side transistor may have a high Vth relative to one or more othertransistors in system 100 (e.g., relative to the drain-side transistorin the cascode arrangement). Additionally or alternatively, in somecases, the gate of the drain-side transistor of the cascode arrangementmay be configured to be biased by a dynamic control signal, which may beconfigured to reduce the magnitude of a drain-to-gate anddrain-to-source voltage differential for the drain-side transistor whenthe component of system 100 that includes the cascode arrangement is instandby mode. In some cases, the dynamic control signal may be generatedor provided by, or its voltage controlled by, a controller (e.g., amemory controller) included in system 100.

The memory device 110 may include a local memory controller 160 and oneor more memory arrays 165 (e.g., memory array 165-a, memory array 165-b,and/or memory array 165-N). A memory array 165 may be a collection ofmemory cells, with each memory cell being configured to store at leastone bit of digital data. Features of memory arrays 165 and/or memorycells are described in more detail with reference to FIG. 2.

The local memory controller 160 may include circuits or componentsconfigured to control operation of the memory device 110. As such, thelocal memory controller 160 may be configured to receive, transmit, orexecute commands, data, or control information related to the memorydevice 110. The local memory controller 160 may be configured tocommunicate with the controller 105, the one or more memory arrays 165,or the processor 125. In some cases, the memory device 110 may receivedata and/or commands from the controller 105. For example, the memorydevice 110 may receive a write command indicating that the memory device110 is to store certain data on behalf of a component of the system 100(e.g., the processor 125). The local memory controller 160 comprises thehardware, firmware, and software that enables the memory device 110 toperform commands or access operations (e.g., write or read). Examples ofthe components included in the local memory controller 160 may includereceivers for demodulating signals received from the controller 105,decoders for modulating and transmitting signals to the controller 105,logic, decoders, amplifiers, filters, or the like.

The controller 105 may be configured to enable communication ofinformation, data, and/or commands between components of the system 100(e.g., the processor 125) and the memory device 110. The controller 105may act as a liaison between the components of the system 100 and thememory device 110 so that the components of the system 100 may not needto know the details of the memory device's operation. The components ofthe system 100 may present requests to the controller 105 (e.g., readcommands or write commands) that the controller 105 satisfies. Thecontroller 105 may convert or translate communications exchanged betweenthe components of the system 100 and the memory device 110.

In some cases, the controller 105 or other component of the system 100,or its functions described herein, may be implemented by the processor125. For example, the controller 105 may be hardware, firmware, orsoftware, or any combination thereof of the system 100 that isconfigured to control the memory device 110. In some cases, thecontroller 105, or its functions described herein, may be implemented bya memory device 110. For example, the controller 105 may be hardware,firmware, or software, or some combination thereof implemented by thelocal memory controller 160. Similarly, in some cases, one or morefunctions ascribed herein to the local memory controller 160 may in somecases be performed by the controller 105 (either separate or as includedin the processor 125). In some cases, the controller 105 may bedistributed across the processor 125 and the memory device 110 such thatportions of the controller 105 are implemented by the processor 125 andother portions are implemented by a local memory controller 160.

The components of the system 100 may exchange information with thememory device 110 using a plurality of channels 115. In some examples,the channels 115 may enable communications between the controller 105and the memory device 110. Each channel 115 may include one or moresignal paths or transmission mediums (e.g., conductors) betweenterminals associated with the components of system 100. For example, achannel 115 may include a first terminal that may include one or morepins or pads at controller 105 and a second terminal that may includeone or more pins or pads at the memory device 110. A pin may be anexample of a conductive input or output point of a device of the system100. A pin may be configured to act as part of a channel. In some cases,a pin or pad of a terminal may correspond to a signal path of thechannel 115. Additional signal paths may be coupled with a terminal of achannel for routing signals within a component of the system 100. Forexample, the memory device 110 may include signal paths that route asignal from a terminal of a channel 115 to the various components of thememory device (e.g., memory cells).

Some channels 115 may be dedicated to communicating specific types ofinformation. In some cases, the channels 115 may include one or morecommand and address (CA) channels 170. The CA channels 170 may beconfigured to communicate commands between the controller 105 and thememory device 110 including control information associated with thecommands (e.g., address information). For example, the CA channel 170may communicate a read command to the memory device 110 with an addressof the stored data to be read. In some cases, the CA channels 170 may beregistered on a rising clock edge and/or a falling clock edge.

In some cases, the channels 115 may include one or more clock (CK)channels 175. The CK channels 175 may be configured to communicate oneor more clock signals between the controller 105 and the memory device110. The clock signal may be configured oscillate between a high stateand low state and coordinate the actions of the controller 105 and thememory device 110. In some cases, the clock signal may be a differentialsignal and the signal paths of the CK channels 175 may be configuredaccordingly. In some cases, the clock signal may be single ended. Theclock signal may be generated by a system clock, which may comprise oneor more hardware components (e.g., oscillators, crystals, logic gates,transistors, or the like).

In some cases, the channels 115 may include one or more data (DQ)channels 180. The data channels 180 may be configured to communicatedata and/or control information between the controller 105 and thememory device 110. For example, the data channels 180 may communicateinformation to be written to the memory device 110 or information readfrom the memory device 110. The data channels 180 may communicatesignals that may be modulated using a variety of different modulationschemes (e.g., NRZ, PAM4, etc.). In some cases, a data channel 180 maybe ×4 (e.g., including four signal paths), ×8 (e.g., including eightsignal paths), ×16 (including sixteen signal paths), etc.

In some cases, the channels 115 may include one or more other channels185 that may be dedicated to other purposes. Examples of other channelsmay include write clock channels, error detection code channels, orcombinations thereof.

The channels 115 may couple the controller 105 with the memory device110 using a variety of different architectures. Examples of the variousarchitectures of the channels 115 may include a bus, a point-to-pointconnection, a crossbar, a high-density interposer such as a siliconinterposer, or channels formed in an organic substrate or somecombination thereof. For example, in some cases, at least a portion of asignal path may be formed using a high-density interposer, such as asilicon interposer or a glass interposer.

Signals communicated over the channels 115 may be modulated using avariety of different modulation schemes. In some cases, a binary-symbol(or binary-level) modulation scheme may be used to modulate signalscommunicated between the controller 105 and the memory device 110. Abinary-symbol modulation scheme may be an example of a M-ary modulationscheme where M is equal to two. Each symbol of a binary-symbolmodulation scheme may be configured to represent one bit of digital data(e.g., a symbol may represent a logic 1 or a logic 0). Examples ofbinary-symbol modulation schemes include, but are not limited to,non-return-to-zero (NRZ), unipolar encoding, bipolar encoding,Manchester encoding, pulse amplitude modulation (PAM) having two symbols(e.g., PAM2), and/or others.

In some cases, a multi-symbol (or multi-level) modulation scheme may beused to modulate signals communicated between the controller 105 and thememory device 110. A multi-symbol modulation scheme may be an example ofa M-ary modulation scheme where M is greater than or equal to three.Each symbol of a multi-symbol modulation scheme may be configured torepresent more than one bit of digital data (e.g., a symbol mayrepresent a logic 00, a logic 01, a logic 10, or a logic 11). Examplesof multi-symbol modulation schemes include, but are not limited to,PAM4, PAM8, etc., quadrature amplitude modulation (QAM), quadraturephase shift keying (QPSK), and/or others. A multi-symbol signal or aPAM4 signal may be a signal that is modulated using a modulation schemethat includes at least three levels to encode more than one bit ofinformation. Multi-symbol modulation schemes and symbols mayalternatively be referred to as non-binary, multi-bit, or higher-ordermodulation schemes and symbols.

FIG. 2 illustrates an example of a memory sub-array 200 in accordancewith various examples of the present disclosure. The memory sub-array200 may be an example of at least a portion of the memory dice describedwith reference to FIG. 1. In some cases, the memory sub-array 200 may bereferred to as a memory die, memory chip, a memory device, or anelectronic memory apparatus. For example, a memory device such as amemory chip may include multiple instances of sub-array 200, withadditional row, address, bank, or bank group decoding used to select oneor more sub-arrays from the multiple instances for access operations.The memory sub-array 200 may include one or more memory cells 205 thatare programmable to store different logic states. Each memory cell 205may be programmable to store two or more states. For example, the memorycell 205 may be configured to store one bit of digital logic at a time(e.g., a logic 0 and a logic 1). In some cases, a single memory cell 205(e.g., a multi-level memory cell) may be configured to store more thanone bit of digit logic at a time (e.g., a logic 00, logic 01, logic 10,or a logic 11).

A memory cell 205 may store a charge representative of the programmablestates in a capacitor. DRAM architectures may include a capacitor thatincludes a dielectric material to store a charge representative of theprogrammable state. In other memory architectures, other storage devicesand components are possible. For example, nonlinear dielectric materialsmay be employed.

Operations such as reading and writing may be performed on memory cells205 by activating or selecting access lines such as a word line 210and/or a digit line 215. In some cases, digit lines 215 may also bereferred to as bit lines. References to access lines, word lines anddigit lines, or their analogues, are interchangeable without loss ofunderstanding or operation. Activating or selecting a word line 210 or adigit line 215 may include applying a voltage to the respective line orconfiguring a multiplexer to map the line to a given signal.

The memory sub-array 200 may include the access lines (e.g., the wordlines 210 and the digit lines 215) arranged in a grid-like pattern.Memory cells 205 may be positioned at intersections of the word lines210 and the digit lines 215. By biasing a word line 210 (e.g., applyinga voltage to the word line 210), a memory cell 205 may be accessed viathe digit line 215 at their intersection.

Accessing the memory cells 205 may be controlled through a row decoder220 or a column decoder 225. For example, a row decoder 220 may receivea row address from the local memory controller 260 and activate a wordline 210 based on the received row address. A column decoder 225 mayreceive a column address from the local memory controller 260 and mayselect a digit line 215 based on the received column address. Forexample, the memory sub-array 200 may include multiple word lines 210,labeled WL_1 through WL_M, and multiple digit lines 215, labeled DL_1through DL N, where M and N depend on the size of the memory array.Thus, by activating a word line 210, e.g., WL_1, the memory cells 205 ina given row may be accessed. The digit lines 215 (e.g., DL_1, . . . , DLN) carry the data for writing or reading from the memory cells in therow. The intersection of a word line 210 and a digit line 215, in eithera two-dimensional or three-dimensional configuration, may be referred toas an address of a memory cell 205.

The memory cell 205 may include a logic storage component, such ascapacitor 230 and a switching component 235. The capacitor 230 may be anexample of a dielectric capacitor or a ferroelectric capacitor. A firstnode of the capacitor 230 may be coupled with the switching component235 and a second node of the capacitor 230 may be coupled with a voltagesource 240. In some cases, the voltage source 240 may be the cell platereference voltage, such as Vpl, or may be ground, such as Vss. In somecases, the voltage source 240 may be an example of a plate line coupledwith a plate line driver. The switching component 235 may be an exampleof a transistor or any other type of switch device that selectivelyestablishes or de-establishes electronic communication between twocomponents.

Selecting or deselecting the memory cell 205 may be accomplished byactivating or deactivating the switching component 235. The capacitor230 may be in electronic communication with the digit line 215 using theswitching component 235. For example, the capacitor 230 may be isolatedfrom digit line 215 when the switching component 235 is deactivated, andthe capacitor 230 may be coupled with digit line 215 when the switchingcomponent 235 is activated. In some cases, the switching component 235is a transistor and its operation may be controlled by applying avoltage to the transistor gate, where the voltage differential betweenthe transistor gate and transistor source may be greater or less than athreshold voltage of the transistor. In some cases, the switchingcomponent 235 may be a p-type transistor or an n-type transistor. Theword line 210 may be in electronic communication with the gate of theswitching component 235 and may activate/deactivate the switchingcomponent 235 based on a voltage being applied to word line 210.

A word line 210 may be a conductive line in electronic communicationwith a memory cell 205 that is used to perform access operations on thememory cell 205. In some architectures, the word line 210 may be inelectronic communication with a gate of a switching component 235 of amemory cell 205 and may be configured to control the switching component235 of the memory cell. In some architectures, the word line 210 may bein electronic communication with a node of the capacitor of the memorycell 205 and the memory cell 205 may not include a switching component.

A digit line 215 may be a conductive line that connects the memory cell205 with a sense component 245. In some architectures, the memory cell205 may be selectively coupled with the digit line 215 during portionsof an access operation. For example, the word line 210 and the switchingcomponent 235 of the memory cell 205 may be configured to couple and/orisolate the capacitor 230 of the memory cell 205 and the digit line 215.In some architectures, the memory cell 205 may be in electroniccommunication (e.g., constant) with the digit line 215.

The sense component 245 may be configured to detect a state (e.g., acharge) stored on the capacitor 230 of the memory cell 205 and determinea logic state of the memory cell 205 based on the stored state. Thecharge stored by a memory cell 205 may be extremely small, in somecases. As such, the sense component 245 may include one or more senseamplifiers to amplify the signal output by the memory cell 205. Thesense amplifiers may detect small changes in the charge of a digit line215 during a read operation and may produce signals corresponding to alogic state 0 or a logic state 1 based on the detected charge. During aread operation, the capacitor 230 of memory cell 205 may output a signal(e.g., via charge sharing) to its corresponding digit line 215. Thesignal may cause a voltage of the digit line 215 to change. The sensecomponent 245 may be configured to compare the signal received from thememory cell 205 across the digit line 215 to a reference signal 250(e.g., reference voltage). The sense component 245 may determine thestored state of the memory cell 205 based on the comparison.

For example, in binary-signaling, if digit line 215 has a higher voltagethan the reference signal 250, the sense component 245 may determinethat the stored state of memory cell 205 is a logic 1 and, if the digitline 215 has a lower voltage than the reference signal 250, the sensecomponent 245 may determine that the stored state of the memory cell 205is a logic 0. The sense component 245 may include amplifiers (e.g.,transistor amplifiers) to detect and amplify a difference in thesignals. The detected logic state of memory cell 205 may be outputthrough column decoder 225 as output 255. In some cases, the aspects ofsense component 245 may be part of another component (e.g., a columndecoder 225, row decoder 220). In some cases, the sense component 245may be in electronic communication with the row decoder 220 or thecolumn decoder 225.

The local memory controller 260 may control the operation of memorycells 205 through the various components (e.g., row decoder 220, columndecoder 225, and sense component 245). The local memory controller 260may be an example of the local memory controller 160 described withreference to FIG. 1. In some cases, aspects of the row decoder 220,column decoder 225, or sense component 245 may be co-located with thelocal memory controller 260. The local memory controller 260 may beconfigured to receive commands and/or data from an external memorycontroller 105 (or a device memory controller described with referenceto FIG. 1), translate the commands and/or data into information that canbe used by the memory sub-array 200, perform one or more operations onthe memory sub-array 200, and communicate data from the memory sub-array200 to the external memory controller 105 (or the device memorycontroller) in response to performing the one or more operations.

The local memory controller 260 may generate row and column addresssignals to activate the target word line 210 and select the target digitline 215. The local memory controller 260 may also generate and controlvarious voltages or currents used during the operation of the memorysub-array 200. In general, the amplitude, shape, or duration of anapplied voltage or current discussed herein may be adjusted or variedand may be different for the various operations discussed in operatingthe memory sub-array 200.

In some cases, the local memory controller 260 may be configured toperform a write operation (e.g., a programming operation) on one or morememory cells 205 of the memory sub-array 200. During a write operation,a memory cell 205 of the memory sub-array 200 may be programmed to storea desired logic state. In some cases, a plurality of memory cells 205may be programmed during a single write operation. The local memorycontroller 260 may identify a target memory cell 205 on which to performthe write operation. The local memory controller 260 may identify atarget word line 210 and a target digit line 215 in electroniccommunication with the target memory cell 205 (e.g., the address of thetarget memory cell 205). The local memory controller 260 may activatethe target word line 210 (e.g., applying a voltage to the word line210), to access a row including the target memory cell 205. The localmemory controller 260 may apply a specific signal (e.g., voltage) to thedigit line 215 during the write operation to store a specific state(e.g., charge) in the capacitor 230 of the memory cell 205, the specificstate (e.g., charge) may be indicative of a desired logic state.

In some cases, the local memory controller 260 may be configured toperform a read operation (e.g., a sense operation) on one or more memorycells 205 of the memory sub-array 200. During a read operation, thelogic state stored in a memory cell 205 of the memory sub-array 200 maybe determined. In some cases, a plurality of memory cells 205 may besensed during a single read operation. The local memory controller 260may identify a target memory cell 205 on which to perform the readoperation. The local memory controller 260 may identify a target wordline 210 and a target digit line 215 in electronic communication withthe target memory cell 205 (e.g., the address of the target memory cell205). The local memory controller 260 may activate the target word line210 (e.g., applying a voltage to the word line 210), to access a rowincluding the target memory cell 205.

The target memory cell 205 may transfer a signal to the sense component245 in response to biasing the access lines. The sense component 245 mayamplify the signal. The local memory controller 260 may fire the sensecomponent 245 (e.g., latch the sense component) and thereby compare thesignal received from the memory cell 205 to the reference signal 250.Based on that comparison, the sense component 245 may determine a logicstate that is stored on the memory cell 205. The local memory controller260 may communicate the logic state stored on the memory cell 205 to theexternal memory controller 105 (or the device memory controller) as partof the read operation (e.g., by selecting data read from digit lines 215using column decoder 225).

In some memory architectures, accessing the memory cell 205 may degradeor destroy the logic state stored in a memory cell 205. For example, aread operation performed in DRAM architectures may partially orcompletely discharge the capacitor of the target memory cell. The localmemory controller 260 may perform a re-write operation or a refreshoperation to return the memory cell to its original logic state. Thelocal memory controller 260 may re-write the logic state to the targetmemory cell after a read operation. In some cases, the re-writeoperation may be considered part of the read operation. Additionally,activating a single access line, such as a word line 210, may disturbthe state stored in some memory cells in electronic communication withthat access line. Thus, a re-write operation or refresh operation may beperformed on one or more memory cells that may not have been accessed.

One or more aspects of memory array 200 may include transistorsconfigured in accordance with the techniques described herein. Forexample, one or more of row decoder 220, column decoder 225, sensecomponent 245, local memory controller 260 may include transistorsconfigured in accordance with the techniques described herein. Asanother example, a switching component 235 of one or more memory cells205 may comprise one or more transistors configured in accordance withthe techniques described herein.

FIG. 3 illustrates an example of a circuit 300 in accordance withvarious examples of the present disclosure. The circuit 300 may includean inverter 305 (e.g., a first inverter) coupled with an inverter 310(e.g., a second inverter). The inverter 305 or the inverter 310 may beincluded in aspects of system 100 and/or memory array 200 as describedwith reference to FIGS. 1 and 2, or features of the inverter 305 or theinverter 310 or techniques described in the context thereof may beincluded in aspects of system 100 and/or memory array 200 as describedwith reference to FIGS. 1 and 2. In some examples, the circuit 300 mayinclude a plurality of inverters coupled together in series—though theexample of circuit 300 shows two inverters coupled in series, any numberof inverters may be coupled in series.

The inverter 305 may include a transistor 320 (e.g., a firsttransistor), a transistor 325 (e.g., a second transistor), and atransistor 330 (e.g., a third transistor). The transistor 320 and thetransistor 330 may be NMOS transistors, and the transistor 320 may be aPMOS transistor. A source of the transistor 320 may be coupled with avoltage source 340 (e.g., a first voltage source), which may be a staticsupply voltage and may be referred to as VCCP. A source of thetransistor 325 may be coupled with a voltage source 345 (e.g., a secondvoltage source), which may be a static supply voltage with a voltagelower than that of the voltage source 340 and may be referred to as VSS.In some examples, the transistor 320 and/or the transistor 325 mayinclude a bulk connection (not shown), which may be biased at a staticvoltage. A gate of the transistor 330 may be coupled with a controlsignal 335 (e.g., PDNf), which may be a first dynamic control (bias)signal, and its source may be coupled with a drain of the transistor325.

The NMOS side of the inverter 305 may include a cascode arrangementcomprising the transistor 325 and the transistor 330, and the transistor325 may be an NMOS source-side transistor and the transistor 330 may bean NMOS drain-side transistor within the cascode arrangement. Becausethe control signal 335 may be adjusted (e.g., adjusted dynamically),leakage current through the cascode arrangement (e.g., ISUB and GIDL)may be mitigated during, for example, a standby mode of the inverter 305or device that includes the inverter 305. Additionally or alternatively,the transistor 325 may have a higher Vth than one or more othertransistors (e.g., relative to the transistor 330). Increasing the Vthof transistor 325 may reduce leakage current (e.g., ISUB) throughtransistors 325 and 330.

In some examples, the inverter 305 may be or may be referred to as afirst inverter. The inverter may include transistor 320 and transistor325, which may be coupled with an input line 315. The input line 315 maybe coupled with one or more components of an integrated circuit (notshown). For example, the input line 315 may be coupled with a memorycell (e.g., a memory cell 205 as described with reference to FIG. 2) andmay receive an input signal associated with a logic state of the memorycell (e.g., a logic “1”). As another example, the input line 315 may becoupled with, provided by, or otherwise controlled (e.g., activated) bya memory controller (e.g., local memory controller 260). In someexamples, the input line 315 may be coupled with a gate of thetransistor 320 and a gate of the transistor 325. Thus, the gate voltage(e.g., Vg) of the transistor 320 and the gate voltage of the transistor325 may be equal to or otherwise based on the voltage of the input line315. For example, a voltage of the input line 315 may be higher if theinput signal were associated with a logic “1” than if the input signalwere associated with a logic “0”.

In some examples, the transistor 320 may be coupled with a voltagesource 340 (e.g., a first voltage source; VCCP). For example, a sourceof the transistor 320 may be coupled with the voltage source 340 suchthat the transistor 320 may be activated (e.g., it may be turned “on”)based on a value of the voltage applied to the source of the transistor320 (e.g., from the voltage source 340) and a value applied to the gateof the transistor 320 (e.g., from the input line 315).

In some examples, the transistor 325 may be coupled with a voltagesource 345 (e.g., a second voltage source; VSS). For example, a sourceof the transistor 325 may be coupled with the voltage source 345 suchthat the transistor 325 may be activated (e.g., it may be turned “on”)based on a value of the voltage applied to the source of the transistor325 (e.g., from the voltage source 345) and a value applied to the gateof the transistor 325 (e.g., from the input line 315).

In some examples, the transistor 330 may be coupled with a controlsignal 335. The control signal 335 may be provided by a dynamic controlline and may be configured to provide an adjustable (e.g., a dynamic)control (bias) signal to the transistor 330. As described herein, one ormore transistors may be susceptible to certain leakage currents (e.g.,ISUB and/or GIDL) during particular operating modes. For example, duringa standby mode of the inverter 305 or a device that includes theinverter 305, the voltage of input line 315 may be “low” (e.g., equal tothe voltage of the voltage source 345) such that transistors 325 and 330are in an off state, and it may be beneficial to reduce an amount ofleakage current through the transistors 325 and 330.

In some cases, adjusting the voltage of the control signal 335 (e.g., bya memory controller or other control component or circuitry) based onentering the standby mode may mitigate leakage current through thetransistors 325 and 330. More specifically, if the transistor 330comprises an NMOS-type transistor, leakage may occur when the gatevoltage (e.g., Vg) is less than the drain voltage (e.g., Vd). Forexample, a larger difference between Vg and Vd may result in greaterleakage current received at node 350. By adjusting (e.g., decreasing)the gate voltage Vg of the transistor 330, the difference between Vg andVd may be lessened and, in turn, the amount of GIDL at the node 350 maybe mitigated.

For example, during an active mode of the inverter 305 or a device thatincludes the inverter 305, the input signal 315 may be active (e.g.,toggling or otherwise varying in voltage). The input signal may beactivated by a control component (e.g., a memory controller or othercontrol circuitry) during the active mode. During a standby mode of theinverter 305 or a device that includes the inverter 305, the inputsignal 315 may be inactive (e.g., static in voltage, such as maintainedat a voltage equal to the voltage source 345). The input signal may bedeactivated by the control component (e.g., the memory controller orother control circuitry) based at least in part on the inverter 305 orthe device that includes the inverter 305 entering standby mode and mayremain deactivated throughout the standby mode.

During the active mode, the control signal 335 may have a higher voltage(e.g., equal to the voltage of voltage source 340) than during thestandby mode (e.g., a voltage equal to the voltage of voltage source 340or a voltage between the voltage of voltage source 345 and the voltageof voltage source 340. Thus, the voltage of the control signal and thusthe voltage of the gate of the transistor 330 may be reduced during thestandby mode, which may cause a reduction in the voltage of the sourceof the transistor 330 and therefore a reduction in the voltage of thedrain of the transistor 325. Reducing the voltage of the drain of thetransistor 325 may reduce leakage current (e.g., GIDL and ISUB) throughthe transistors 325 and 330. In some cases, where the voltage of thecontrol signal 335 is between the voltage of voltage source 345 and thevoltage of voltage source 340, the control signal 335 may have a voltageswing less than a difference in voltage between the voltage source 340and the voltage source 345.

Though increasing the Vth of transistor 325 may reduce leakage current,in some examples, high Vth transistors may occupy more space in anintegrated circuit or may for some other reason be a less preferabledesign choice (aside from leakage current considerations) than atransistor having a relatively lower Vth. Stated another way, forexample, a transistor having a relatively lower Vth may be smaller insize than a transistor having a relatively higher Vth. Although aninverter or other circuit utilizing only relatively low Vth transistorsmay occupy a smaller portion of an integrated circuit, low Vthtransistors may be more susceptible to leakage currents. Thus, a designhaving an optimal combination of relatively low Vth transistors andrelatively high Vth transistors may be preferable. As described hereinwith reference to FIG. 4, the inverter 305 or another circuit inaccordance with the techniques described herein may include variousconfigurations (combinations) of low Vth and high Vth transistors toreduce leakage current (e.g., ISUB and/or GIDL) while enhancing otherdesign or performance characteristics (e.g., the overall size of thecircuit).

As described herein, when operating in an active mode, the inverter 305may receive an input signal via input line 315. More specifically, theinput signal may be applied to a gate of the transistor 320 and thetransistor 325. The input signal may be associated with, for example, alogic state of a memory cell (e.g., a memory cell 205 as described withreference to FIG. 2). As another example, the input signal may beassociated with some other aspect of the operation of a memory device orother electronic device. In some examples, the inverter 305 may be in anactive mode when the initial input signal is varying between a “high”value (voltage) and a “low” value (voltage). For example, when the inputsignal is “high”, this may result in a voltage at the node 350 being“low”. More specifically, a “high” voltage received via input line 315may cause the transistor 320 to reside in an inactive (e.g., an “off”)state, and may cause the transistor 325 to reside in an active (e.g., an“on”) state. Thus, during an active state, the input line 315 mayalternate between a “high” voltage and a “low” voltage, which may resultin the node 350 alternating between a “low” voltage and “high” voltage,respectively.

In some examples, when the inverter 305 or a device that includes theinverter 305 is in an inactive mode (e.g., a standby mode), the inputsignal may be maintained (e.g., may be static) at the “low” voltage(e.g., the input signal is associated with a logic “0”). When the inputsignal received via input line 315 is “low”, the transistor 320 mayreside in an active (e.g., an “on”) state and the transistor 325 mayreside in an inactive (e.g., an “off”) state. The operation of theinverter 305 is discussed in greater detail below with reference to FIG.5.

In some examples, the transistor 320 may be a PMOS-type transistor andmay be coupled with a voltage source 340 (e.g., VCCP). Because VCCP maybe a greater voltage than a voltage applied to the gate of thetransistor 320 when the input signal 315 is low, the transistor 320 maybe activated by a “low” input voltage. Conversely, for example, a “high”input voltage applied to the gate of the transistor 320 may be a higher(e.g., a greater) voltage than VCCP, thus nominally disabling thetransistor 320.

Additionally or alternatively, the transistor 325 may be an NMOS-typetransistor and may be coupled with a voltage source 345 (e.g., VSS).Because a “high” input voltage applied to the gate of the transistor 320may be a greater voltage than VSS, this may activate the transistor 320.Conversely, for example, a “low” input voltage applied to the gate ofthe transistor 325 may be equal to or less than VSS, thus nominallydisabling the transistor 320.

In some examples, when an input signal received via input line 315 is“low”, the output of the inverter 305 may be “high”. For example, outputline 355 may apply a relatively “high” voltage to the inverter 310. Asdescribed herein, the inverter 310 may be or may be referred to as asecond inverter. The inverter 310 may include transistor 360 andtransistor 370, which may be coupled with the output line 355 (e.g., theoutput line from the inverter 305). In some examples, the output line355 may be coupled with a gate of the transistor 360 and a gate of thetransistor 370. Thus, the gate voltage (e.g., Vg) of the transistor 360and the transistor 370 may be inversely associated with a voltage valueapplied to the inverter 305 via the input line 315. The transistor 360may be a PMOS source-side transistor and may be coupled with transistor365 in a cascode arrangement in which transistor 365 is a PMOSdrain-side transistor. The transistor 370 may be an NMOS source-sidetransistor and may be coupled with transistor 375 in a cascodearrangement in which transistor 375 is an NMOS drain-side transistor.

In some examples, the transistor 360 may be coupled with a voltagesource 340 (e.g., a first voltage source; VCCP). For example, a sourceof the transistor 360 may be coupled with the voltage source 340 suchthat the transistor 360 may be activated (e.g., it may be turned “on”)based on a value of the voltage applied to the source of the transistor360 (e.g., from the voltage source 340) and a value applied to the gateof the transistor 360 (e.g., from the output line 355).

In some examples, the transistor 370 may be coupled with a voltagesource 345 (e.g., a second voltage source; VSS). For example, a sourceof the transistor 370 may be coupled with the voltage source 345 suchthat the transistor 370 may be activated (e.g., it may be turned “on”)based on a value of the voltage applied to the source of the transistor370 (e.g., from the voltage source 345) and a value applied to the gateof the transistor 370 (e.g., from the output line 355).

In some examples, the transistor 365 may be coupled with a controlsignal 390 (e.g., a second control line; PDN), which may be a seconddynamic control (bias) signal. The control signal 390 may be or may bereferred to as a dynamic control line and may be configured to providean adjustable (e.g., a dynamic) control (bias) signal to the transistor365. In some examples, the control signal 390 may be complimentary tothe control signal 335. Stated another way, the control signal 390 maybe inverted relative to the control signal 335. In some cases, thecontrol signal 390 may be inverted and shifted relative to the controlsignal 335—e.g., may be low when the control signal 335 is high and viceversa, and may have different common mode voltage that the controlsignal 335.

When the second inverter 310 or a device that includes the secondinverter 310 is in standby mode, the voltage of the control signal 390may be higher than when the second inverter 310 or the device thatincludes the second inverter 310 is in active mode. Increasing thevoltage of the control signal 390 and thus of the gate of the transistor365 during standby mode may raise the voltage of the source of thetransistor 365 and therefore of the drain of the transistor 360 duringstandby mode. Accordingly, biasing the gate of the transistor 365 withthe control signal 390 and increasing the voltage of the control signal390 during standby mode may reduce leakage current (e.g., GIDL or ISUB)through the transistors 360 and 365.

In some cases, the transistor 360 may have a relatively high Vth (e.g.,relative to one or more other transistors in second inverter 310 or thedevice that includes the second inverter 310). For example, thetransistor 360 may have a relatively high Vth compared to the transistor365. Increasing the Vth of the transistor 360 may reduce leakage current(e.g., ISUB) through the transistors 360 and 365.

In some cases, a gate of the transistor 375 may be biased using a staticbias voltage, such as the voltage source 340. In some cases, biasing thegate of the transistor 375 with a static bias voltage may be based onthe transistor 370 and thus the cascode configuration that includes thetransistor 375 being configured to be on (at least in terms of terminalvoltages) during standby mode, such that the PMOS cascode configurationthat includes the transistor 360 is responsible for minimizing leakagecurrent through the second inverter 310. Similarly, in some cases, thetransistor 320 in the first inverter 305 may not be configured as partof a cascode arrangement based on the transistor 320 being configured tobe on (at least in terms of terminal voltages) during standby mode, suchthat the NMOS cascode configuration that includes the transistor 325 isresponsible for minimizing leakage current through the first inverter305.

In some examples, the inverter 310 may output an inverted signal basedon a value of the signal received via output line 355. For example, ifthe signal received via output line 355 is “low” then output line 385may output a “high” signal. In some examples (not shown) the output line385 may be coupled with an additional inverter that may operate in asame or similar manner as the inverter 305, which may in turn be coupledwith an additional inverter that may operate in a same or similar manneras the inverter 310—any number of such converts may be coupled togetherin series.

FIG. 4 illustrates an example of a table 400 depicting exampletransistor types implemented in a circuit that supports leakage currentreduction in electronic devices in accordance with aspects of thepresent disclosure, using the circuit 300 of FIG. 3 as an example. Thetable 400 may illustrate various configurations and transistor typesthat may be implemented in a circuit (e.g., a circuit 300 as describedwith reference to FIG. 3). In some examples, the table 400 mayillustrate various transistor types that may be selected as a matter ofdesign choice. The transistors shown in FIG. 4 may correspond to, forexample, transistor 320, transistor 325, transistor 330, transistor 360,transistor 365, transistor 370, and transistor 375 as described hereinwith reference to FIG. 3.

As described with reference to FIG. 3, transistor 320, transistor 360,and transistor 365 may each be a PMOS-type transistor. Additionally oralternatively, transistor 325, transistor 330, transistor 370, andtransistor 375 may each be an NMOS-type transistor.

As used herein, the term “high voltage threshold transistor” or “highVth transistor” may refer to a transistor having an increasedgate-to-source voltage (e.g., Vgs) needed to create a conductive pathbetween the source and drain terminals. Additionally or alternatively,the term “low voltage threshold transistor” or “low Vth transistor” mayrefer to a transistor having a decreased gate-to-source voltage (e.g.,Vgs) needed to create a conductive path between the source and drainterminals. A high Vth transistor may, for example, decrease leakagecurrent associated with an inactive transistor (e.g., due tosource-to-drain leakage). A low Vth transistor may, for example, occupyless space (area) and/or have a faster switching speed (smallerpropagation delay) than a high Vth transistor (e.g., in an integratedcircuit) and may therefore be a preferable design choice in some cases.

A first configuration 405 is described. In some examples, a firstinverter (e.g., inverter 305 as described with reference to FIG. 3) mayinclude transistor 320, transistor 325, and transistor 330, and a secondinverter (e.g., inverter 310 as described with reference to FIG. 3) mayinclude transistor 360, transistor 365, transistor 370, and transistor375. In some examples, the transistor 320 and the transistor 325 of thefirst inverter may be high Vth transistors, and the transistor 330 maybe a low Vth transistor. As described with reference to FIG. 3, eitherthe transistor 320 or the transistor 325 may be inactive when theinverter operates in an inactive mode, depending on whether the voltageof the input signal is high or low during the inactive (standby) mode.Accordingly, selecting high Vth transistors for both the transistor 320and the transistor 325—the source-side transistors within the respectivecascode arrangements—may mitigate leakage current during the standbymode.

In some examples, the transistor 360 and the transistor 370 of thesecond inverter may be high Vth transistors, and the transistor 365 andthe transistor 375 may be low Vth transistors. As described withreference to FIG. 3, either the transistor 360 or the transistor 370 maybe inactive when the second inverter operates in an inactive mode,depending on whether the voltage of the input signal is high or lowduring the inactive (standby) mode. Accordingly, selecting high Vthtransistors for both the transistor 360 and the transistor 370—thesource-side transistors within the respective cascode arrangements—maymitigate leakage current during the standby mode.

A second configuration 410 is described. In a second configuration, oneor more transistors configured to be in an on state (at least in termsof the voltages at the transistor terminals) may be changed, relative tothe first configuration 405, to be low Vth transistors as suchtransistors may not be involved in reducing leakage current duringstandby mode and thus area savings or other benefits that may beassociated with low Vth transistors may be desired. Accordingly,transistor 320 and transistor 370 may be switched from high Vthtransistors in the first configuration 405 to low Vth transistors in thesecond configuration 410.

Conversely, the transistor 325 may remain a high Vth transistor in thesecond configuration 410 to help minimize leakage current associatedwith the inverter 305 and transistor 360 may remain a high Vthtransistor in the second configuration 410 to help minimize leakagecurrent associated with the inverter 310.

In some cases, based on a fabrication process, a first type oftransistor (e.g., a PMOS-type transistor) may have a first propagationdelay (switching speed) and a second type of transistor (e.g., anNMOS-type transistor) may have a second propagation delay (switchingspeed). A propagation delay may refer to, for example, the time for acurrent through a transistor (e.g., from the drain to the source) tochange in response to a change in gate voltage. Some fabricationprocesses may result in NMOS transistors having smaller propagationdelays than PMOS transistors, with other parameters held constant. Otherfabrication processes may result in PMOS transistors having smallerpropagation delays than NMOS transistors, with other parameters heldconstant. Additionally or alternatively, high Vth transistors and lowVth transistors may be associated with different operating speeds(propagation delays). For example, a low Vth transistor may operatefaster than a high Vth transistor, with other parameters held constant.

The third configuration 415 may be associated with a fabrication processin which, with other parameters held constant, NMOS transistors have alarger propagation delay than PMOS transistors. Accordingly, all NMOStransistors in the third configuration 415 may be low Vth transistors,so as to offset the larger inherent propagation delay of the NMOStransistors, while the PMOS transistors in the third configuration 415may be the same as in the first configuration 405.

The fourth configuration 420 may be associated with a fabricationprocess in which, with other parameters held constant, PMOS transistorshave a larger propagation delay than NMOS transistors. Accordingly, allPMOS transistors may be low Vth transistors, so as to offset the largerinherent propagation delay of the PMOS transistors, while the NMOStransistors in the third configuration 415 may be the same as in thefirst configuration 405.

FIG. 5 illustrates a timing diagram 500 in accordance with variousexamples of the present disclosure. The timing diagram 500 mayillustrate one or more operations of a circuit (e.g., an inverter) thatsupports leakage current reduction in electronic devices. For example,the timing diagram 500 may illustrate an input signal 515 (e.g., asignal received via input line 315 as described with reference to FIG.3), an output signal 520 (e.g., a signal output via output line 385 asdescribed with reference to FIG. 3), a control signal 525 (e.g., acontrol signal 390 as described with reference to FIG. 3), and a controlsignal 530 (e.g., a control signal 335 as described with reference toFIG. 3). In some examples, the timing diagram 500 may illustrateoperations of one or more inverters during an active mode 505 and aninactive (e.g., a standby) mode 510.

As described herein, during an active mode 505 an inverter may receivean input signal 515 and output an output signal 520. The output signal520 may be, for example, delayed relative to the input signal 515.Changes in the output signal 520 (e.g., rising or falling edges of theoutput signal 520) may be delayed relative to corresponding changes inthe input signal 515 (e.g., rising or falling edges of the input signal515), as in some cases multiple inverters (e.g., inverter 305 andinverter 310 as described with reference to FIG. 3) may be coupledtogether to introduce a time delay in an integrated circuit.

For example, with reference to FIG. 3, the inverter 305 may receive aninput signal via input line 315 that is “high”. Subsequently (with somenon-zero amount of delay), the inverter 305 may output a signal (viaoutput line 355) that is an inverse of the input signal (e.g., a “low”signal). The inverter 310 may receive the “low” signal as an input andmay subsequently (with some non-zero amount of delay) output a signal(via output line 385) that is an inverse of the received signal (e.g., a“high” signal). Accordingly, the signal received at inverter 305 andoutput by inverter 310 may be a same or similar signal—a “high”signal—but may be delayed by a time associated with the operations ofinverter 305 and inverter 310.

Accordingly, during active mode 505, input signal 515 may represent asignal received by a first inverter (e.g., inverter 305) and outputsignal 520 may represent a signal output by a subsequent inverter (e.g.,inverter 310). The input signal 515 and output signal 520 may be a sameor a similar signal (e.g., a “signal” and/or a “low” signal) delayed intime. In some examples, as described herein, during the active mode 505a control signal may be applied to each of the inverters. For example,the control signal 530 may be applied to a first inverter (e.g.,inverter 305) during the active mode 505, and the control signal 525 maybe applied to a second inverter (e.g., inverter 310) during the activemode 505. In some examples, the control signal 525 may be a same orsimilar voltage as control signal 390 as described with reference toFIG. 3 (e.g., VSS), and the control signal 530 may be a same or similarvoltage as control signal 335 as described with reference to FIG. 3.

In some examples, control signals that are a same or similar voltage asVSS and VCCP, respectively, may be applied to the inverters during atleast a portion of an active mode 505. For example, the control signal525 may be at a voltage equal to VSS during at least a portion of activemode 505 (e.g., during the portion of active mode 505 immediately priorto inactive mode 510). As another example, the control signal 530 may beat a voltage equal to VCCP during at least a portion of active mode 505(e.g., during the portion of active mode 505 immediately prior toinactive mode 510).

During inactive mode 510, a “low” signal may be applied to a firstinverter (e.g., in the input signal 315 may be deactivated, maintainedat a static voltage, which may correspond to VSS and/or a low logicvalue). As described herein, during an inactive mode 510, theinverter(s) may be susceptible to leakage current through one or moretransistors (e.g., across one or more inactive transistors). The leakagecurrent may be reduced, for example, by adjusting a voltage of thecontrol signal 525 and/or the control signal 530. For example, thecontrol signal 525 (e.g., PDN) may be increased to increase a gatevoltage (e.g., Vg) of a transistor (e.g., transistor 365 as describedwith reference to FIG. 3). Additionally or alternatively, the controlsignal 530 (e.g., PDNf) may be decreased to decrease a gate voltage of adifferent transistor (e.g., transistor 330 as described with referenceto FIG. 3). By increasing or decreasing a gate voltage of a respectivetransistors, leakage current (e.g., GIDL or ISUB) through the respectivetransistor may be minimized (e.g., by causing a corresponding increaseor decrease in the drain voltage of a source-side transistor cascodedwith the respective transistor).

In some examples, the control signal 525 (e.g., PDN) may be increased toa voltage level (e.g., VDD1) that is greater than VSS, which may reduceleakage current across the transistor. In some cases, VDD1 may begreater than VSS and also lower than VCCP, which may reduce leakagecurrent across the transistor while utilizing less power (e.g., whileutilizing a change in the control signal 525 of a lower magnitude)relative to changing the control signal 525 voltage from VSS to VCCP.Thus, the control signal 525 may have a voltage swing (differencebetween its maximum and minimum voltage values) that is smaller than thedifference between VCCP and VSS, and applying a control signal 525 at asame or similar voltage level as VDD1 may reduce an amount of leakagecurrent across the transistor with increased power savings.

In some examples, the control signal 530 (e.g., PDNf) may be decreasedto a voltage level (e.g., VDD2) that is lower than VCCP, which mayreduce leakage current across the transistor. In some cases, VDD2 may belower than VCCP and also greater than VSS, which may reduce leakagecurrent across the transistor while utilizing less power (e.g., whileutilizing a change in the control signal 530 of a lower magnitude)relative to changing the control signal 530 voltage from VCCP to VSS.Thus, the control signal 530 may have a voltage swing (differencebetween its maximum and minimum voltage values) that is smaller than thedifference between VCCP and VSS, and applying a control signal 530 at asame or similar voltage level as VDD2 may reduce an amount of leakagecurrent across the transistor with increased power savings.

FIG. 6 shows a block diagram 600 of a device 605 that supports leakagecurrent reduction in electronic devices in accordance with aspects ofthe present disclosure. The device 605 may include a reception component610, an application component 615, a deactivation component 620, anadjustment component 625, and a biasing component 630. Each of thesemodules may communicate, directly or indirectly, with one another (e.g.,via one or more buses).

The reception component 610 may receive an input signal at a firsttransistor and a second transistor. In some examples, the receptioncomponent 610 may receive an output signal at a fourth transistor and asixth transistor.

The application component 615 may apply a dynamic control signal to agate of a third transistor that is coupled with the second transistor ina cascode configuration. In some examples, the application component 615may apply, prior to deactivating the input signal, a second dynamiccontrol signal to a gate of a fifth transistor that is coupled with thefourth transistor in a cascode configuration.

The deactivation component 620 may deactivate the input signal afterapplying the dynamic control signal. In some examples, deactivating theinput signal includes maintaining the voltage of the input signal at aconstant level. In some examples, deactivating the input signal includesremoving the input signal from the first transistor and the secondtransistor.

The adjustment component 625 may adjust a voltage of the dynamic controlsignal based on deactivating the input signal. In some examples, theadjustment component 625 may adjust a voltage of the second dynamiccontrol signal based on deactivating the input signal.

The biasing component 630 may bias a source of the first transistor to afirst voltage that is greater than a maximum voltage of the dynamiccontrol signal. In some cases, biasing a source of the second transistorto a second voltage, where adjusting the voltage of the dynamic controlsignal includes adjusting the voltage of the dynamic control signal byan amount less than a difference between the voltage and the secondvoltage.

FIG. 7 shows a flowchart illustrating a method 700 that supports leakagecurrent reduction in electronic devices in accordance with aspects ofthe present disclosure. The operations of method 700 may be implementedby a memory controller or its components as described herein. Forexample, the operations of method 700 may be performed by a one or morecomponents as described with reference to FIG. 6. In some examples, amemory controller may execute a set of instructions to control thefunctional elements of the memory device to perform the functionsdescribed below. Additionally or alternatively, a memory device mayperform aspects of the functions described below using special-purposehardware.

At 705, the memory device may receive an input signal at a firsttransistor and a second transistor. The operations of 705 may beperformed according to the methods described herein. In some examples,aspects of the operations of 705 may be performed by a receptioncomponent as described with reference to FIG. 6.

At 710, the memory device may apply a dynamic control signal to a gateof a third transistor that is coupled with the second transistor in acascode configuration. The operations of 710 may be performed accordingto the methods described herein. In some examples, aspects of theoperations of 710 may be performed by an application component asdescribed with reference to FIG. 6.

At 715, the memory device may deactivate the input signal after applyingthe dynamic control signal. The operations of 715 may be performedaccording to the methods described herein. In some examples, aspects ofthe operations of 715 may be performed by a deactivation component asdescribed with reference to FIG. 6.

At 720, the memory device may adjust a voltage of the dynamic controlsignal based on deactivating the input signal. The operations of 720 maybe performed according to the methods described herein. In someexamples, aspects of the operations of 720 may be performed by anadjustment component as described with reference to FIG. 6.

In some examples, an apparatus as described herein may perform a methodor methods, such as method 700. The apparatus may include features,means, or instructions (e.g., a non-transitory computer-readable mediumstoring instructions executable by a processor) for receiving an inputsignal at a first transistor and a second transistor, applying a dynamiccontrol signal to a gate of a third transistor that is coupled with thesecond transistor in a cascode configuration, deactivating the inputsignal after applying the dynamic control signal, and adjusting avoltage of the dynamic control signal based at least in part ondeactivating the input signal.

Some examples of the methods, apparatuses, and non-transitorycomputer-readable medium described herein may further includeoperations, features, means, or instructions for biasing a source of thesecond transistor to a second voltage. In some examples of the methods,apparatuses, and non-transitory computer-readable medium describedherein, adjusting the voltage of the dynamic control signal may includeadjusting the voltage of the dynamic control signal by an amount lessthan a difference between the voltage and the second voltage.

Some examples of the methods, apparatuses, and non-transitorycomputer-readable medium described herein may further includeoperations, features, means, or instructions for biasing a source of thefirst transistor to a first voltage that is greater than a maximumvoltage of the dynamic control signal.

In some examples of the methods, apparatuses, and non-transitorycomputer-readable medium described herein, deactivating the input signalcomprises maintaining the voltage of the input signal at a constantlevel. In some examples of the methods, apparatuses, and non-transitorycomputer-readable medium described herein, deactivating the input signalcomprises removing the input signal from the first transistor and thesecond transistor.

Some examples of the methods, apparatuses, and non-transitorycomputer-readable medium described herein may further includeoperations, features, means, or instructions for receiving an outputsignal at a fourth transistor and a sixth transistor, applying, prior todeactivating the input signal, a second dynamic control signal to a gateof a fifth transistor that is coupled with the fourth transistor in acascode configuration, and adjusting a voltage of the second dynamiccontrol signal based at least in part on deactivating the input signal.

FIG. 8 shows a flowchart illustrating a method 800 that supports leakagecurrent reduction in electronic devices in accordance with aspects ofthe present disclosure. The operations of method 800 may be implementedby a memory controller or its components as described herein. Forexample, the operations of method 800 may be performed by a one or morecomponents as described with reference to FIG. 6. In some examples, amemory controller may execute a set of instructions to control thefunctional elements of the memory device to perform the functionsdescribed below. Additionally or alternatively, a memory device mayperform aspects of the functions described below using special-purposehardware.

At 805, the memory device may receive an input signal at a firsttransistor and a second transistor. The operations of 805 may beperformed according to the methods described herein. In some examples,aspects of the operations of 805 may be performed by a receptioncomponent as described with reference to FIG. 6.

At 810, the memory device may apply a dynamic control signal to a gateof a third transistor that is coupled with the second transistor in acascode configuration. The operations of 810 may be performed accordingto the methods described herein. In some examples, aspects of theoperations of 810 may be performed by an application component asdescribed with reference to FIG. 6.

At 815, the memory device may deactivate the input signal after applyingthe dynamic control signal. The operations of 815 may be performedaccording to the methods described herein. In some examples, aspects ofthe operations of 815 may be performed by a deactivation component asdescribed with reference to FIG. 6.

At 820, the memory device may bias a source of the second transistor toa second voltage, where adjusting the voltage of the dynamic controlsignal includes. The operations of 820 may be performed according to themethods described herein. In some examples, aspects of the operations of820 may be performed by a biasing component as described with referenceto FIG. 6.

At 825, the memory device may adjust a voltage of the dynamic controlsignal based on deactivating the input signal. The operations of 825 maybe performed according to the methods described herein. In someexamples, aspects of the operations of 825 may be performed by anadjustment component as described with reference to FIG. 6.

FIG. 9 shows a flowchart illustrating a method 900 that supports leakagecurrent reduction in electronic devices in accordance with aspects ofthe present disclosure. The operations of method 900 may be implementedby a memory controller or its components as described herein. Forexample, the operations of method 900 may be performed by a one or morecomponents as described with reference to FIG. 6. In some examples, amemory controller may execute a set of instructions to control thefunctional elements of the memory device to perform the functionsdescribed below. Additionally or alternatively, a memory device mayperform aspects of the functions described below using special-purposehardware.

At 905, the memory device may receive an input signal at a firsttransistor and a second transistor. The operations of 905 may beperformed according to the methods described herein. In some examples,aspects of the operations of 905 may be performed by a receptioncomponent as described with reference to FIG. 6.

At 910, the memory device may apply a dynamic control signal to a gateof a third transistor that is coupled with the second transistor in acascode configuration. The operations of 910 may be performed accordingto the methods described herein. In some examples, aspects of theoperations of 910 may be performed by an application component asdescribed with reference to FIG. 6.

At 915, the memory device may deactivate the input signal after applyingthe dynamic control signal. The operations of 915 may be performedaccording to the methods described herein. In some examples, aspects ofthe operations of 915 may be performed by a deactivation component asdescribed with reference to FIG. 6.

At 920, the memory device may bias a source of the first transistor to afirst voltage that is greater than a maximum voltage of the dynamiccontrol signal. The operations of 920 may be performed according to themethods described herein. In some examples, aspects of the operations of920 may be performed by a biasing component as described with referenceto FIG. 6.

At 925, the memory device may adjust a voltage of the dynamic controlsignal based on deactivating the input signal. The operations of 925 maybe performed according to the methods described herein. In someexamples, aspects of the operations of 925 may be performed by anadjustment component as described with reference to FIG. 6.

It should be noted that the methods described above describe possibleimplementations, and that the operations and the steps may be rearrangedor otherwise modified and that other implementations are possible.Furthermore, aspects from two or more of the methods may be combined.

In some examples, an apparatus or device may perform aspects of thefunctions described herein. The device may include a first transistorcoupled with an input line and configured to receive an input signalfrom the input line, a second transistor coupled with the input line andconfigured to receive the input signal from the input line, and a thirdtransistor coupled with the second transistor in a cascode configurationand configured to receive a dynamic control signal and output an outputsignal based at least in part on receiving the dynamic control signal.

In some examples, a source of the first transistor is configured to bebiased at a first voltage that is greater than a maximum voltage of thedynamic control signal. In some examples, a source of the secondtransistor is configured to be biased at a second voltage, and whereinthe dynamic control signal is configured to have a voltage swing that issmaller than a difference between the first voltage and the secondvoltage.

In some examples, the device may include an inverter that comprises thefirst transistor, the second transistor, and the third transistor, afourth transistor coupled with an output line of the inverter andconfigured to receive the output signal from the output line, a fifthtransistor coupled with the fourth transistor in a cascodeconfiguration, wherein the fifth transistor is configured to receive asecond dynamic control signal and output a second output signal based atleast in part on receiving the second dynamic control signal, a sixthtransistor coupled with the output line of the inverter, wherein thesixth transistor is configured to receive the output signal from theoutput line, and a seventh transistor coupled with the sixth transistorin a cascode configuration, wherein the seventh transistor is configuredto output the second output signal based at least in part on the sixthtransistor receiving the output signal.

In some examples, the device may include a second inverter thatcomprises the fourth transistor, the fifth transistor, the sixthtransistor, and the seventh transistor. In some examples, the sixthtransistor is configured to be activated when the apparatus is in astandby mode, and wherein the sixth transistor has a lower thresholdvoltage than the fourth transistor. In some examples, the fourthtransistor has a lower threshold voltage than the sixth transistor.

In some examples, the second dynamic control signal is configured to beinverted relative to the dynamic control signal. In some examples, thedevice may include control circuitry configured to vary a voltage of thedynamic control signal. In some examples, the first transistor isconfigured to be activated when the apparatus is in a standby mode, andwherein the first transistor has a lower threshold voltage than thesecond transistor. In some examples, the third transistor has a lowerthreshold voltage than the second transistor. In some examples, thefirst transistor comprises a PMOS transistor, and wherein the secondtransistor and the third transistor each comprise an NMOS transistor.

In some examples, the first transistor comprises a first type ofchannel, and wherein the second transistor and the third transistor eachcomprise a second type of channel different than the first type ofchannel. In some examples, the first transistor and the secondtransistor each have a higher threshold voltage than the thirdtransistor. In some examples, the first transistor has a firstpropagation delay and the second transistor has a second propagationdelay that is larger than the first propagation delay, and wherein thesecond transistor has a voltage threshold that is lower than the firsttransistor. In some examples, the first transistor has a firstpropagation delay and the second transistor has a second propagationdelay that is smaller than the first propagation delay, and wherein thesecond transistor has a voltage threshold that is higher than the firsttransistor.

Information and signals described herein may be represented using any ofa variety of different technologies and techniques. For example, data,instructions, commands, information, signals, bits, symbols, and chipsthat may be referenced throughout the above description may berepresented by voltages, currents, electromagnetic waves, magneticfields or particles, optical fields or particles, or any combinationthereof. Some drawings may illustrate signals as a single signal;however, it will be understood by a person of ordinary skill in the artthat the signal may represent a bus of signals, where the bus may have avariety of bit widths.

The terms “electronic communication,” “conductive contact,” “connected,”and “coupled” may refer to a relationship between components thatsupports the flow of signals between the components. Components areconsidered in electronic communication with (or in conductive contactwith or connected with or coupled with) one another if there is anyconductive path between the components that can, at any time, supportthe flow of signals between the components. At any given time, theconductive path between components that are in electronic communicationwith each other (or in conductive contact with or connected with orcoupled with) may be an open circuit or a closed circuit based on theoperation of the device that includes the connected components. Theconductive path between connected components may be a direct conductivepath between the components or the conductive path between connectedcomponents may be an indirect conductive path that may includeintermediate components, such as switches, transistors, or othercomponents. In some cases, the flow of signals between the connectedcomponents may be interrupted for a time, for example, using one or moreintermediate components such as switches or transistors.

The term “coupling” refers to condition of moving from an open-circuitrelationship between components in which signals are not presentlycapable of being communicated between the components over a conductivepath to a closed-circuit relationship between components in whichsignals can be communicated between components over the conductive path.When a component, such as a controller, couples other componentstogether, the component initiates a change that allows signals to flowbetween the other components over a conductive path that previously didnot permit signals to flow.

The term “isolated” refers to a relationship between components in whichsignals are not presently capable of flowing between the components.Components are isolated from each other if there is an open circuitbetween them. For example, two components separated by a switch that ispositioned between the components are isolated from each other when theswitch is open. When a controller isolates two components from oneanother, the controller affects a change that prevents signals fromflowing between the components using a conductive path that previouslypermitted signals to flow.

The devices discussed herein, including a memory array, may be formed ona semiconductor substrate, such as silicon, germanium, silicon-germaniumalloy, gallium arsenide, gallium nitride, etc. In some cases, thesubstrate is a semiconductor wafer. In other cases, the substrate may bea silicon-on-insulator (SOI) substrate, such as silicon-on-glass (SOG)or silicon-on-sapphire (SOP), or epitaxial layers of semiconductormaterials on another substrate. The conductivity of the substrate, orsub-regions of the substrate, may be controlled through doping usingvarious chemical species including, but not limited to, phosphorous,boron, or arsenic. Doping may be performed during the initial formationor growth of the substrate, by ion-implantation, or by any other dopingmeans.

A switching component or a transistor discussed herein may represent afield-effect transistor (FET) and comprise a three terminal deviceincluding a source, drain, and gate. The terminals may be connected toother electronic elements through conductive materials, e.g., metals.The source and drain may be conductive and may comprise a heavily-doped,e.g., degenerate, semiconductor region. The source and drain may beseparated by a lightly-doped semiconductor region or channel. If thechannel is n-type (e.g., majority carriers are electrons), then the FETmay be referred to as a n-type FET. If the channel is p-type (e.g.,majority carriers are holes), then the FET may be referred to as ap-type FET. The channel may be capped by an insulating gate oxide. Thechannel conductivity may be controlled by applying a voltage to thegate. For example, applying a positive voltage or negative voltage to ann-type FET or a p-type FET, respectively, may result in the channelbecoming conductive. A transistor may be “on” or “activated” when avoltage greater than or equal to the transistor's threshold voltage isapplied to the transistor gate. The transistor may be “off” or“deactivated” when a voltage less than the transistor's thresholdvoltage is applied to the transistor gate.

The description set forth herein, in connection with the appendeddrawings, describes example configurations and does not represent allthe examples that may be implemented or that are within the scope of theclaims. The term “exemplary” used herein means “serving as an example,instance, or illustration,” and not “preferred” or “advantageous overother examples.” The detailed description includes specific details toproviding an understanding of the described techniques. Thesetechniques, however, may be practiced without these specific details. Insome instances, well-known structures and devices are shown in blockdiagram form to avoid obscuring the concepts of the described examples.

In the appended figures, similar components or features may have thesame reference label. Further, various components of the same type maybe distinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. If just the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

Information and signals described herein may be represented using any ofa variety of different technologies and techniques. For example, data,instructions, commands, information, signals, bits, symbols, and chipsthat may be referenced throughout the above description may berepresented by voltages, currents, electromagnetic waves, magneticfields or particles, optical fields or particles, or any combinationthereof

The various illustrative blocks and modules described in connection withthe disclosure herein may be implemented or performed with ageneral-purpose processor, a DSP, an ASIC, an FPGA or other programmablelogic device, discrete gate or transistor logic, discrete hardwarecomponents, or any combination thereof designed to perform the functionsdescribed herein. A general-purpose processor may be a microprocessor,but in the alternative, the processor may be any conventional processor,controller, microcontroller, or state machine. A processor may also beimplemented as a combination of computing devices (e.g., a combinationof a DSP and a microprocessor, multiple microprocessors, one or moremicroprocessors in conjunction with a DSP core, or any other suchconfiguration).

The functions described herein may be implemented in hardware, softwareexecuted by a processor, firmware, or any combination thereof Ifimplemented in software executed by a processor, the functions may bestored on or transmitted over as one or more instructions or code on acomputer-readable medium. Other examples and implementations are withinthe scope of the disclosure and appended claims. For example, due to thenature of software, functions described above can be implemented usingsoftware executed by a processor, hardware, firmware, hardwiring, orcombinations of any of these. Features implementing functions may alsobe physically located at various positions, including being distributedsuch that portions of functions are implemented at different physicallocations. Also, as used herein, including in the claims, “or” as usedin a list of items (for example, a list of items prefaced by a phrasesuch as “at least one of” or “one or more of”) indicates an inclusivelist such that, for example, a list of at least one of A, B, or C meansA or B or C or AB or AC or BC or ABC (e.g., A and B and C). Also, asused herein, the phrase “based on” shall not be construed as a referenceto a closed set of conditions. For example, an exemplary step that isdescribed as “based on condition A” may be based on both a condition Aand a condition B without departing from the scope of the presentdisclosure. In other words, as used herein, the phrase “based on” shallbe construed in the same manner as the phrase “based at least in parton.”

The description herein is provided to enable a person skilled in the artto make or use the disclosure. Various modifications to the disclosurewill be apparent to those skilled in the art, and the generic principlesdefined herein may be applied to other variations without departing fromthe scope of the disclosure. Thus, the disclosure is not limited to theexamples and designs described herein but is to be accorded the broadestscope consistent with the principles and novel features disclosedherein.

1. A method, comprising: receiving an input signal at a first transistorand a second transistor; applying a dynamic control signal to a gate ofa third transistor that is coupled with the second transistor in acascode configuration; deactivating the input signal after applying thedynamic control signal; and adjusting a voltage of the dynamic controlsignal based at least in part on deactivating the input signal.
 2. Themethod of claim 1, further comprising: biasing a source of the secondtransistor to a second voltage, wherein adjusting the voltage of thedynamic control signal comprises: adjusting the voltage of the dynamiccontrol signal by an amount less than a difference between the voltageand the second voltage.
 3. The method of claim 1, further comprising:biasing a source of the first transistor to a first voltage that isgreater than a maximum voltage of the dynamic control signal.
 4. Themethod of claim 1, wherein: deactivating the input signal comprisesmaintaining the voltage of the input signal at a constant level.
 5. Themethod of claim 1, wherein: deactivating the input signal comprisesremoving the input signal from the first transistor and the secondtransistor.
 6. The method of claim 1, further comprising: receiving anoutput signal at a fourth transistor and a sixth transistor; applying,prior to deactivating the input signal, a second dynamic control signalto a gate of a fifth transistor that is coupled with the fourthtransistor in a cascode configuration; and adjusting a voltage of thesecond dynamic control signal based at least in part on deactivating theinput signal.
 7. An apparatus, comprising: a first transistor coupledwith an input line and configured to receive an input signal from theinput line; a second transistor coupled with the input line andconfigured to receive the input signal from the input line; and a thirdtransistor coupled with the second transistor in a cascode configurationand configured to receive a dynamic control signal and output an outputsignal based at least in part on receiving the dynamic control signal,wherein the third transistor has a lower threshold voltage than thesecond transistor, and wherein a source of the first transistor isconfigured to be biased at a first voltage that is greater than amaximum voltage of the dynamic control signal.
 8. (canceled)
 9. Theapparatus of claim 8, wherein a source of the second transistor isconfigured to be biased at a second voltage, and wherein the dynamiccontrol signal is configured to have a voltage swing that is smallerthan a difference between the first voltage and the second voltage. 10.An apparatus, comprising: a first transistor coupled with an input lineand configured to receive an input signal from the input line; a secondtransistor coupled with the input line and configured to receive theinput signal from the input line; a third transistor coupled with thesecond transistor in a cascode configuration and configured to receive adynamic control signal and output an output signal based at least inpart on receiving the dynamic control signal; an inverter that comprisesthe first transistor, the second transistor, and the third transistor; afourth transistor coupled with an output line of the inverter andconfigured to receive the output signal from the output line; a fifthtransistor coupled with the fourth transistor in a cascodeconfiguration, wherein the fifth transistor is configured to receive asecond dynamic control signal and output a second output signal based atleast in part on receiving the second dynamic control signal; a sixthtransistor coupled with the output line of the inverter, wherein thesixth transistor is configured to receive the output signal from theoutput line; and a seventh transistor coupled with the sixth transistorin a cascode configuration, wherein the seventh transistor is configuredto output the second output signal based at least in part on the sixthtransistor receiving the output signal.
 11. The apparatus of claim 10,further comprising: a second inverter that comprises the fourthtransistor, the fifth transistor, the sixth transistor, and the seventhtransistor.
 12. The apparatus of claim 10, wherein the sixth transistoris configured to be activated when the apparatus is in a standby mode,and wherein the sixth transistor has a lower threshold voltage than thefourth transistor.
 13. The apparatus of claim 10, wherein the fourthtransistor has a lower threshold voltage than the sixth transistor. 14.The apparatus of claim 10, wherein the second dynamic control signal isconfigured to be inverted relative to the dynamic control signal. 15.The apparatus of claim 7, further comprising: control circuitryconfigured to vary a voltage of the dynamic control signal.
 16. Theapparatus of claim 7, wherein the first transistor is configured to beactivated when the apparatus is in a standby mode, and wherein the firsttransistor has a lower threshold voltage than the second transistor. 17.(canceled)
 18. The apparatus of claim 7, wherein the first transistorcomprises a PMOS transistor, and wherein the second transistor and thethird transistor each comprise an NMOS transistor.
 19. The apparatus ofclaim 7, wherein the first transistor comprises a first type of channel,and wherein the second transistor and the third transistor each comprisea second type of channel different than the first type of channel. 20.The apparatus of claim 7, wherein the first transistor and the secondtransistor each have a higher threshold voltage than the thirdtransistor.
 21. The apparatus of claim 7, wherein the first transistorhas a first propagation delay and the second transistor has a secondpropagation delay that is larger than the first propagation delay, andwherein the second transistor has a voltage threshold that is lower thanthe first transistor.
 22. The apparatus of claim 7, wherein the firsttransistor has a first propagation delay and the second transistor has asecond propagation delay that is smaller than the first propagationdelay, and wherein the second transistor has a voltage threshold that ishigher than the first transistor.
 23. An apparatus, comprising: a firsttransistor coupled with an input line and configured to have a sourcebiased at a first voltage; a second transistor coupled with the inputline and configured to have a source biased at a second voltage; a thirdtransistor coupled with the second transistor in a cascodeconfiguration, wherein an inverter comprises the first transistor, thesecond transistor, and the third transistor; and a memory controllercoupled with the inverter and operable to cause the apparatus to:receive an input signal at the first transistor and the secondtransistor; apply a dynamic control signal to a gate of the thirdtransistor; deactivate the input signal after applying the dynamiccontrol signal to the gate of the third transistor; and adjust a voltageof the dynamic control signal based at least in part on deactivating theinput signal.
 24. The apparatus of claim 23, further comprising: afourth transistor coupled with an output line of the inverter andconfigured to have a source biased at the first voltage; a fifthtransistor coupled with the fourth transistor in a cascodeconfiguration; a sixth transistor coupled with an output line of theinverter and configured to have a source biased at the second voltage; aseventh transistor coupled with the sixth transistor in a cascodeconfiguration, wherein a second inverter comprises the fourthtransistor, the fifth transistor, the sixth transistor, and the seventhtransistor; and wherein the memory controller is further operable tocause the apparatus to: receive the input signal at the fourthtransistor and the sixth transistor; apply, prior to deactivating theinput signal, a second dynamic control signal to a gate of the fifthtransistor; and adjust a voltage of the second dynamic control signalbased at least in part on deactivating the input signal.
 25. Theapparatus of claim 23, wherein the second dynamic control signal isconfigured to be inverted relative to the dynamic control signal.